Paste Noise Absorber Technology for 5G and 6G Electronics and Packaging

Khasha Ghaffarzadeh

fromTechBlick

29 Apr, 2024

Paste Noise Absorber. Properties. Noise radiation from board patterns

Properties and application of paste technology for noise reduction in high frequency (110-170 GHz) electronic devices and packaging . This is a dispensable material can be easily installed in narrow spaces, suppressing noise inside electronic devices used in beyond 5G/6G

- electronics

- materials

- Printed Electronics

This article was first published on

www.techblick.com

High-frequency devices, such as those used beyond 5G and 6G technologies, require precise and reliable signal transmission for optimal performance. High-frequency signals are more susceptible to noise interference, which can degrade the quality and integrity of the transmitted data. Noise mitigation is crucial to ensure that the intended signal is accurately received and interpreted.

Traditionally, noise-absorbing materials have been used as an effective method of making noise. Noise absorbing materials are generally sheet or sponge type. However, these types are difficult to apply beyond5G/6G devices which become smaller and more complicated.

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To solve this problem, we propose a noise-absorbing paste. Dispensable material can be easily installed in narrow spaces, suppressing noise inside electronic devices used in beyond 5G/6G, and contributing to improved quality and performance.

Features:

Dispensable
Good conformability
High frequencies over 100GHz

Figure 1: Paste Noise Absorber

Table 1: Properties

Figure 2: Absorption vs frequency

Case 1： For solving cavity resonance.

Figure 3: MMIC on antenna module.

Radiation noise of MMIC resonating in the cavity affects the antenna characteristics. (Figure.3). Noise absorbing paste can be installed on small space, and attenuating cavity resonance.

Case 2: For solving noise radiation from board patterns

Figure.4 Noise radiation from board patterns.

Noise radiation from board patterns contaminates the antenna circuit, and it affects antenna characteristics. Noise absorbing paste can be installed on circuit and solve noise radiation, because it has insulation properties.

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PCB Panelization: Everything You Need to Know

PCB Panelization is a PCB manufacturing technique. It involves the grouping of several small printed circuit boards to form a single array, which is known as a panel. Panelization is commonly employed in PCB manufacturing because it saves time and cost. This article discusses the conditions, design considerations, methods, types, and benefits of PCB panelization.

Abiola Ayodele

09 Feb, 2023

electronics

- PCB

- Printed Electronics

Introduction

PCB panelization is a manufacturing technique where smaller circuit boards are produced in bulk and joined to one another to form a single array. This bulk production fosters the easy movement of PCBs through an assembly line. The individual boards can easily be depanelized or removed from the array for packaging or installation into products.

CNC (Computer Numerical Control) machines are utilized in PCB production and assembly facilities. These CNC machines can design PCBs that are rather large in size. But typically, electronic products use small-sized PCBs. Therefore, several copies of the PCB design are given to the CNC machine to fully leverage its capability. This process of producing multiple PCBs on a single board is called PCB Panelization and the resulting board spread is known as a PCB Panel. [1]

PCB Panelization is the most commonly used PCB manufacturing technique, as it saves both time and cost.

What is a PCB Panel?

A PCB panel, also known as a PCB array or PCB matrix, is one board made up of several separate boards. A single array of smaller PCBs is created by integrally connecting them all. Following assembly, the panel is divided into separate PCBs during the breakout process, which is known as depanelization. Each board in the array can be easily separated or removed for packaging or installation into products.

Defects are reduced as a result of the printed circuit board panelization process since automated assembly machines frequently run into less issues during assembly. The panel may feature a single design or a variety of designs. The panel is single-up if there is just one piece or board, and multi-up if there are more. By increasing PCB material utilization, panelization lowers PCB cost and speeds up automated PCB assembly, with less cost. Panels are typically applied to high-volume PCB production.

When is PCB Panelization Required?

The CNC

Image: Examples of three NANOWEB® transparent antennas

NANOWEB - A Revolutionary Transparent Conductive Thin Film

NANOWEB® is an extremely thin, transparent, conductive film that consists of an invisible, nanostructured metal mesh fabricated onto a glass or plastic surface. With its unrivaled transparency, conductivity, and flexibility, this patented functional film holds immense potential for both passive and powered use cases, with applications including electromagnetic interference shielding, antennas, 5G/6G redirection systems for elimination of dead spots, and deicing/defogging devices for vehicle windows and eyewear.

Khasha Ghaffarzadeh

13 Dec, 2022

- electronics

Executive summary

NANOWEB® is an extremely thin, transparent, conductive film that consists of an invisible, nanostructured metal mesh fabricated onto a glass or plastic surface. With its unrivaled transparency, conductivity, and flexibility, this patented functional film holds immense potential for both passive and powered use cases, with applications including electromagnetic interference shielding, antennas, 5G/6G redirection systems for elimination of dead spots, and deicing/defogging devices for vehicle windows and eyewear.

NANOWEB® technology

Transparent conductors are critical components in a wide range of electronic devices, including touchscreens, organic light-emitting diodes (OLEDs), and photovoltaics. They also find frequent use in the optical components of sensors and display systems, including electromagnetic interference (EMI) shielding and transparent heating elements.

Existing transparent conductive electrode (TCE) materials, such as indium tin oxide (ITO) and silver nanowires, suffer from several drawbacks, including poor mechanical stability, low optical transmissivity, low electrical conductivity, high cost, and limited supply. These constraints (or limitations), together with the ever-growing demand for electronic products, have encouraged efforts to explore alternative solutions.

One outcome of such efforts is NANOWEB®, a unique transparent thin-film conductor developed by Meta Materials Inc. (META®) and winner of the IDTechEx “Best Manufacturing Technology” award.

Comprising a precisely arranged mesh of invisible submicron metal wires formed on a glass or plastic substrate, NANOWEB® offers superior electrical and optical properties compared to conventional transparent conductor films.

Distinct from currently available options, NANOWEB®’s transparency is determined by its nanostructured wire mesh geometric spacing and submicron dimensions. As a result, NAN