Development Platform for nRF54L15-based Bluetooth Low Energy Modules

Panasonic PAN B611-1 Evaluation Kits

<p id="isPasted">The Panasonic PAN B611-1 Evaluation Kits support the development and testing of PAN B611-1C and PAN B611-1B modules designed for Bluetooth® 6.0 Low Energy applications. The modules are built around the Nordic Semiconductor nRF54L15 single-chip controller, enabling engineers to evaluate wireless communication, embedded processing, and peripheral interfacing in low-power systems.</p><p>These kits provide access to key module interfaces, including UART, GPIOs, and current measurement pins, allowing developers to monitor power consumption and interface behavior during wireless application development. The onboard Segger J-Link debugger supports programming and debugging, while a virtual COM port enables serial communication through the same interface.</p><p>The kits include 8MB of memory and a slow clock on the EVB to support timing and low-power operation testing. The PAN B611-1B EVB variant incorporates a pre-certified external antenna from TE Connectivity, simplifying wireless evaluation and RF testing.</p><h1>Features of PAN B611-1 Evaluation Kits </h1><p>The PAN B611-1 Evaluation Kits include Bluetooth Low Energy modules, multiple interface connections, integrated debugging support, power measurement capability, and onboard peripherals. The following sections describe the key hardware features in detail:</p><h3>Bluetooth Low Energy Module Integration</h3><p>The PAN B611-1 Evaluation Kits incorporate PAN B611-1C or PAN B611-1B Bluetooth 6.0 Low Energy modules, which are based on the Nordic Semiconductor nRF54L15 single-chip controller. These modules provide access to multiple communication and control interfaces, including UART and GPIOs, allowing developers to evaluate wireless connectivity and peripheral interactions. The PAN B611-1B evaluation board also includes a pre-certified external antenna, enabling RF testing without additional antenna design or certification steps.</p><h3>Development Interfaces and Connectivity</h3><p>The evaluation board supports both Arduino-compatible and mikroBUS™ interfaces, allowing it to operate as either a shield or a standalone development board. All GPIOs are accessible via pin headers, enabling direct connections to external sensors, peripherals, or expansion boards. This configuration enables flexible prototyping and integration with existing development hardware.</p><h3>Debugging and Power Measurement</h3><p>The board integrates a Segger J-Link on-board debugger, enabling programming and debugging through standard development tools. A virtual COM port is available through the debugger interface for serial communication. In addition, the kit provides current measurement pins and a power measurement interface, allowing evaluation of power consumption during operation. </p><h3>Onboard Peripherals and Low-Power Control </h3><p>Four user buttons and four user LEDs are included for input and status indication during application testing. One FPC connector for an NFC antenna is provided, with the antenna included in the kit. Onboard peripherals can be disabled to evaluate low-power operation, and the platform is compatible with nRF Connect SDK-based projects for firmware development and testing. </p><h1>Applications</h1><p>The Panasonic PAN B611-1 Evaluation Kits are used to develop and test Bluetooth Low Energy connectivity in a range of embedded wireless systems. In home automation, the kits support evaluation of connected sensors, smart switches, and control nodes. For lighting control, they enable wireless communication between controllers and luminaires. In patient monitoring, the platform can be used to prototype low-power medical monitoring devices that transmit physiological data. Environmental monitoring applications include wireless sensing nodes for temperature, humidity, or air quality. The kits also support asset monitoring and tracking solutions, providing a development environment for devices that require reliable wireless connectivity and efficient power management. </p>

Panasonic PAN B611-1 Evaluation Kits - Product Brief

Supported Modules

Chip

Wireless Technology

Debug Interface

Memory

Interface Type

Antenna

The Panasonic PAN B611-1 Evaluation Kits support the development and testing of PAN B611-1C and PAN B611-1B modules designed for Bluetooth® 6.0 Low Energy applications.

Supported Modules	PAN B611-1C and PAN B611-1B
Chip	nRF54L15
Wireless Technology	Bluetooth® 6.0 Low Energy
Debug Interface	Segger J-Link On-Board Debugger
Memory	8 MB
Interface Type	GPIO, UART