Development Platform for AIROC™ Wi-Fi/Bluetooth Combo Chipsets

Infineon Technologies AIROC™ Wi-Fi® & Bluetooth® Evaluation Kit

<p id="isPasted">The Infineon Technologies AIROC™ Wi-Fi® and Bluetooth® Evaluation Kit provides a development platform for evaluating wireless connectivity using Infineon Wi-Fi/Bluetooth combo chipsets in embedded systems. The kit is built around the Raspberry Pi Compute Module 4 Lite, enabling development and testing of Internet of Things (IoT) and audio applications within a Linux®-based environment. Wireless connectivity is supported through an M.2 E-Key interface, allowing connection of radio modules such as the included Ezurio Sona™ IF513 module, which integrates the CYW55513 chipset supporting tri-band Wi-Fi 6E (802.11 a/b/g/n/ac/ax) and Bluetooth 5.4.</p><p>The platform supports PCIe® and SDIO interfaces for Wi-Fi and HCI UART for Bluetooth, enabling communication between the radio module and host processor. The baseboard includes HDMI, four USB Type-A ports, a 1 Gb Ethernet interface, and an audio output jack. The additional features include power measurement capability, dipole antenna support, and remote access via UART, enabling wireless application development and performance evaluation.</p><h1>Features of the AIROC Wi-Fi &amp; Bluetooth Evaluation Kit </h1><p>The AIROC Wi-Fi &amp; Bluetooth Evaluation Kit includes support for wireless connectivity, host interfaces, radio module integration, and measurement capabilities. Let’s go through its features in detail:</p><h3>Platform Architecture and Processing</h3><p>The AIROC Wi-Fi &amp; Bluetooth Evaluation Kit is built around the Raspberry Pi Compute Module 4 Lite, providing a Linux-based platform for prototyping wireless applications. This architecture enables developers to evaluate Infineon Wi-Fi/Bluetooth combo chipsets and create IoT or audio solutions using a familiar embedded Linux development environment. A pre-loaded Linux image is provided to simplify system initialization and application testing.</p><h3>Wireless Connectivity and Radio Modules</h3><p>The kit includes an Ezurio Sona IF513 M.2 module based on the CYW55513 chipset, supporting tri-band Wi-Fi 6E (802.11 a/b/g/n/ac/ax) and Bluetooth 5.4 with the AIROC Bluetooth stack. The radio module connects through an M.2 E-Key interface, enabling replacement with other compatible Infineon-based M.2 wireless modules for comparative evaluation. A dipole antenna is provided for RF operation during testing.</p><h3>Communication Interfaces and Host Connectivity</h3><p>The evaluation board supports PCIe and SDIO interfaces for Wi-Fi communication and HCI UART for Bluetooth connectivity, enabling communication between the radio module and the host processor. The baseboard also provides multiple host interfaces, including HDMI, four USB Type-A ports, a 1-Gigabit Ethernet interface, and an audio output jack, supporting system interaction and external device connections. </p><h3>Development and Measurement Features</h3><p>The additional features include power measurement capability, allowing evaluation of wireless module energy consumption during operation. Audio playback functionality is available through the onboard audio output interface. The system also supports remote access through a UART terminal, enabling command-line interaction, debugging, and system monitoring during development. </p><h1>Applications</h1><p>The AIROC Wi-Fi &amp; Bluetooth Evaluation Kit is used to develop and evaluate wireless connectivity in a range of connected systems. In smart home and IoT applications, it supports devices such as IP cameras, smart door locks, home appliances, printers, speakers, gaming peripherals, and connected cameras requiring reliable Wi-Fi and Bluetooth communication. In wearable electronics, the platform can be used to prototype connectivity for smart watches and fitness bands, where low-power wireless links and compact integration are required. It is also applicable in industrial and medical environments, enabling the development of wireless conference systems, automated meter readers, and secure payment terminals requiring network connectivity and embedded Linux support. </p>

Infineon Technologies AIROC™ Wi-Fi® & Bluetooth® Evaluation Kit - Product Brief

Evaluation Kit Model

Host Platform

Wireless Chipset

Wi-Fi Support

Bluetooth Support

Radio Module Interface

Host Interfaces

Development Environment

Applications

The Infineon Technologies AIROC™ Wi-Fi® and Bluetooth® Evaluation Kit provides a development platform for evaluating wireless connectivity using Infineon Wi-Fi/Bluetooth combo chipsets in embedded systems.

Evaluation Kit Model	CYW9RPI55513-EVK
Host Platform	Raspberry Pi Compute Module 4 Lite
Wireless Chipset	CYW55513
Wi-Fi Support	Wi-Fi 6/6E (802.11 a/b/g/n/ac/ax), Tri-Band
Bluetooth Support	Bluetooth® 5.4 with AIROC™ Bluetooth Stack
Radio Module Interface	M.2 E-Key Connector