Component obsolescence is a major challenge for industries relying on electronics. Electronic parts go out of date fast - two to five years on average - and 15 percent disappear from the market annually. Outdated components harm product quality, reliability, and profitability, forcing several times more expensive due to limited supply, demand, counterfeit risks, or redesign. Thus, proactive obsolescence management, starting with product design, is crucial.In this article, we will explore some of the reasons for component obsolescence, some of the best practices for managing it effectively, and some of the benefits of partnering with a supply chain expert who can help you mitigate obsolescence risks and maximize product value.<h2>Reasons for Component Obsolescence</h2>It is essential to understand the <a href="https://www.macrofab.com/blog/component-obsolescence/" target="_blank">factors contributing to component obsolescence</a>, which is a growing challenge for companies within the electronics industry.One significant reason for component obsolescence is the rapid pace of technological innovation and development in the industry. This trend is shortening the life cycles of integrated circuits (ICs) by an average of 30 percent. A study by S&amp;P Global Market Intelligence revealed that over 50 percent of ICs have a lifespan shorter than five years.Another contributing factor is the increasing consolidation and competition in the upstream supply chain through mergers and acquisitions (M&amp;A). This trend has led to more end-of-life (EOL) notifications and faster product life cycle changes. In fact, M&amp;A activity is currently affecting over 200 billion components worldwide, according to IHS Markit.<img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1685020987492-1685020987492.png" alt="Consumer demand electronics" class="fr-fic fr-dii">Additionally, consumer demand for newer and smarter electronic products is driving more frequent upgrades and replacements of existing devices. For example, a recent survey by Accenture found that 47 percent of consumers plan to replace their smartphones every year or sooner.Changes in government regulations and environmental standards also have a significant impact on component availability and compatibility. The Restriction of Hazardous Substances (RoHS) directive, for instance, prohibits the use of certain substances such as lead, mercury, or cadmium in electrical and electronic equipment sold in the European Union.These factors pose significant challenges for companies that must ensure product designs are functional, reliable, compatible, compliant, and profitable throughout their intended life span. As an industry professional, it is crucial to keep up with these trends and their implications to make informed decisions about product design and component selection.<h2>Best Practices for Managing Component Obsolescence</h2><img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1685020987613-1685020987613.png" alt="Best practices managing component obsolescence" class="fr-fic fr-dii">To avoid or minimize the negative impact of component obsolescence on products and systems, it&rsquo;s essential to adopt an obsolescence management strategy during the product design phase. This involves incorporating best practices such as specifying components with long-term availability or multiple sources, leveraging production and order history to anticipate component turnover, communicating with end users to align design with customer expectations, maintaining regulatory compliance, and incorporating design-for-obsolescence strategies to ensure product longevity.To reduce the risk of sourcing difficulties and price fluctuations due to limited supply or high demand, specify components that have long-term availability or have multiple sources for all necessary parts. For instance, choose to use components that are commonly found in other industries like automotive or aerospace, to ensure a stable supply chain. While this creates competition for their purchase, it also ensures they remain readily available, typically from multiple sources, as long as they remain in high demand. When you can&rsquo;t use these strategies, use best practices to <a href="https://www.macrofab.com/blog/reducing-single-source-component-risk" target="_blank">reduce single-source component risks</a>.<img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1685020987443-1685020987443.png" alt="Leverage order production history data" class="fr-fic fr-dii">Leverage production and order history data to gain visibility into component turnover rates and identify parts that are at risk of becoming obsolete or slow-moving. Plan accordingly for inventory management or replacement strategies. Additionally, use data analytics to monitor the usage and performance of components and forecast their life expectancy to stay ahead of potential obsolescence. MacroFab&rsquo;s technology platform is ideally suited to provide this sort of analytical data.Communicating with end-users to understand their needs and expectations regarding product longevity is crucial in ensuring that product design aligns with their requirements. By preventing premature obsolescence, unnecessary costs and dissatisfaction can be avoided.Maintaining regulatory compliance requirements and forecasting their impact on parts in stock and production is essential in ensuring regulatory adherence, avoiding penalties or fines, and anticipating potential component availability or compatibility changes.<h2>Options to Consider at the Design Stage</h2>Design-for-obsolescence strategies such as modularization, standardization, upgradability, and reusability can enhance product flexibility, adaptability, and maintainability, ultimately extending product life span. Below are explanations of each strategy and how to use it:Modularization: This strategy involves designing products as a series of independent modules that can be easily replaced or upgraded. By doing so, end users can replace only the faulty or outdated module instead of buying a completely new device. This results in cost savings for the end user and reduces electronic waste. To implement modularization, design teams should identify the components that are most likely to become obsolete and design them as interchangeable modules.Standardization: This strategy involves using standard components and interfaces that are compatible with other products. For example, using USB ports for charging and data transfer instead of proprietary connectors. Standardization allows for greater interoperability between products, making it easier for end-users to replace or upgrade components. This strategy also makes it easier for manufacturers to source components and will ultimately reduce costs.<img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1685020987557-1685020987557.png" alt="Upgrade ram" class="fr-fic fr-dii">Upgradability: This strategy involves designing products with the ability to upgrade specific components, such as RAM or storage. This extends the lifespan of the product and provides cost savings for the end user. Design teams should identify the components that are most likely to need upgrading and design the product with this in mind.Reusability: This strategy involves designing products with the ability to repurpose them after their initial use&ndash; for example, repurposing an old smartphone as a security camera. By designing products with reusability in mind, companies can reduce waste and possibly create new revenue streams by meeting two demands with one product. Design teams should identify potential secondary uses for the product and design it with these in mind.By implementing these design-for-obsolescence strategies, electronic industry professionals can create more sustainable products that offer cost savings for end-users and reduce environmental impact. These strategies also align with ESG initiatives, making them a worthwhile investment for companies looking to improve their sustainability performance.<h2>Benefits of Partnering with a Supply Chain Expert</h2>Effectively managing component obsolescence requires expertise, resources, and time that many businesses may not have internally. A supply chain expert offering obsolescence management services can be beneficial. These services include optimizing inventory levels, improving quality and customer satisfaction, and providing business intelligence and decision-making support.<img src="https://s3-us-west-1.amazonaws.com/wevolver-project-images/froala%2F1685020987654-1685020987654.png" alt="Supply chain infographic" class="fr-fic fr-dii">Optimizing inventory levels, reducing waste, and avoiding disruptions or delays in production or delivery can save costs and increase profits. For instance, companies can implement inventory optimization software that analyzes demand patterns and optimizes stock levels, reducing inventory carrying costs.Ensuring product performance, reliability, and safety is critical for improving quality and customer satisfaction. Businesses can achieve this by implementing a quality management system that monitors and controls processes and activities affecting quality throughout the supply chain.Providing business intelligence tools that track and record geographical and financial data about sales and help optimize supply chain strategy can enhance business intelligence and decision-making. The result can be an increase in sales and profitability for companies.Getting help with obsolescence management from a supply chain expert can allow companies to focus on their core competencies, reduce costs, improve quality, enhance customer satisfaction, and grow their business. Companies can achieve their business objectives and manage component obsolescence effectively by partnering with a supply chain partner.<h2>Conclusion</h2>Component obsolescence is inevitable in today&rsquo;s dynamic electronics industry. However, it does not have to threaten product success if companies adopt a proactive obsolescence management strategy that begins at the design stage. Your business can mitigate obsolescence risks and maximize product value throughout its life cycle by following some best practices and partnering with a supply chain expert offering comprehensive solutions. <section id="isPasted"><h4>Lifecycle Problems?</h4>Find Parts with MacroFab<a href="https://www.macrofab.com/blog/strategic-sourcing-production-planning" target="_blank">STRATEGIC SOURCING &amp; PRODUCTION PLANNING</a></section><section><h4> </h4><div data-aos="fade-up" data-aos-duration="750"> </div></section>

Fifteen percent of electronic parts disappear from the market annually.  Are you ready if one of them affects your design? 

Component Obsolescence Begins at Design

When entering the connected device market, businesses are looking for IoT solutions that can keep costs manageable, scale effectively with business demands, and keep data secure.In particular, scaling effectively requires proper consideration for provisioning, configuration, monitoring, and analysis of the connected devices because making the wrong decisions early on can get costly later. Getting scalability right is even more critical for sensors deployed in remote and inaccessible locations.One of our clients initially planned on building their own custom IoT solution for their remote monitored devices that are being deployed in 10 locations. While being a more affordable cost up-front, a custom, in-house solution would require our client to be responsible for all maintenance throughout a device&rsquo;s lifecycle. This ongoing maintenance would mean increased resources &ndash; and increased costs, <a href="https://www.outsystems.com/glossary/what-is-technical-debt/" target="_blank">known as &ldquo;tech debt&rdquo;</a>.<img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNjc5OTQ3OTgzMjY0LTE2Nzk5NDc5ODMyNjQucG5nIiwiZWRpdHMiOnsicmVzaXplIjp7IndpZHRoIjo5NTAsImZpdCI6ImNvdmVyIn19fQ==" alt="" width="100%" height="auto" srcset="https://www.mistywest.com/wp-content/uploads/2022/04/mistywest-benefits-standard-iot-framework-01.png 909w, https://www.mistywest.com/wp-content/uploads/2022/04/mistywest-benefits-standard-iot-framework-01-300x194.png 300w, https://www.mistywest.com/wp-content/uploads/2022/04/mistywest-benefits-standard-iot-framework-01-768x496.png 768w" sizes="(max-width: 909px) 100vw, 909px" class="fr-fic fr-dii">Our client ultimately decided on using a standard IoT framework&ndash;<a href="https://www.mistywest.com/posts/azure-vs-aws-which-iot-framework-is-right-for-you/" target="_blank">such as Azure, AWS</a>, or Google Cloud Platform&ndash;where they&rsquo;d pay more for the development up front, but have lower operating costs in the long term. This solution also does not require specialized resources to know the technical systems.In this post, we look at the 5 major selling features of an IoT framework for a device deployment.&nbsp;<h2>1. Cradle to grave tracking of devices</h2>Our client selected Azure for their IoT framework, using it to provision devices on the assembly line and make a first-time connection. After this, the devices can arrive up-to-date and automatically update to the latest firmware, and any calibration, configuration, or firmware changes are tracked during manufacturing as well as out in the field in an automatic, consistent, cloud-hosted way.<img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNjc5OTQ3OTg0MTM3LTE2Nzk5NDc5ODQxMzcucG5nIiwiZWRpdHMiOnsicmVzaXplIjp7IndpZHRoIjo5NTAsImZpdCI6ImNvdmVyIn19fQ==" alt="" width="100%" height="auto" srcset="https://www.mistywest.com/wp-content/uploads/2022/04/mistywest-benefits-standard-iot-framework-02.png 906w, https://www.mistywest.com/wp-content/uploads/2022/04/mistywest-benefits-standard-iot-framework-02-300x158.png 300w, https://www.mistywest.com/wp-content/uploads/2022/04/mistywest-benefits-standard-iot-framework-02-768x405.png 768w" sizes="(max-width: 906px) 100vw, 906px" class="fr-fic fr-dii"><h2>2. Ability to determine at-a-glance whether a device is problematic</h2>Devices dial out to the cloud to establish connectivity, and that connectivity is tracked by Azure&rsquo;s IoT system. Proactive alerts can be set if a device has not appeared online for a while or data has not been uploaded. All of this automation helps minimize downtime and data loss.&nbsp;<h2>3. Continuous uploading and organization of data</h2>The devices will upload data continuously, whenever there is a connection. The data goes into a standard cloud-hosted storage solution (blob storage) which keeps the data centralized and accessible to those who need it, while also being monitored to ensure the devices are functioning correctly. The data upload can trigger further data processing and automated pipelines that give real time insights into activity.<img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNjc5OTQ3OTgyNzk4LTE2Nzk5NDc5ODI3OTgucG5nIiwiZWRpdHMiOnsicmVzaXplIjp7IndpZHRoIjo5NTAsImZpdCI6ImNvdmVyIn19fQ==" alt="" width="100%" height="auto" srcset="https://www.mistywest.com/wp-content/uploads/2022/04/mistywest-benefits-standard-iot-framework-03.png 906w, https://www.mistywest.com/wp-content/uploads/2022/04/mistywest-benefits-standard-iot-framework-03-300x190.png 300w, https://www.mistywest.com/wp-content/uploads/2022/04/mistywest-benefits-standard-iot-framework-03-768x487.png 768w" sizes="(max-width: 906px) 100vw, 906px" class="fr-fic fr-dii"><h2>4. Offline (queued) updates to parameters and firmware</h2>Devices on a standard framework don&rsquo;t have to be online to queue up changes to parameters and schedule new firmware updates &ndash; they can be in storage, in transit, or in use. Businesses can adopt a &ldquo;set it and forget it&rdquo; mindset knowing updates will be automatically applied. This reduces additional coordination work.&nbsp;<h2>5. Mass updates to the smart device&rsquo;s parameters</h2>Updates to parameters can be easily made fleet-wide, or to any subset of devices. As the product evolves, these changes can be made to optimize operation, and subsets of devices can be used as a test bed before rolling out changes to a larger number. The built-in optimization for updates helps decrease device management overhead.&nbsp;<h2>Conclusion</h2>When looking at scaling of deployments, the economics favor the standard IoT framework. By using a standard solution you&rsquo;re leveraging thousands of engineering hours, other companies&rsquo; testing, and have the benefit of continued development of new features useful to (and not driven by) your business.Think about what scale your business is going to be reaching when considering your own connectivity solution &ndash; if you plan on continuing to grow, adopting a standard solution will be the more affordable and manageable solution in the long run. This article was originally written by Kevin Baillie, Mechatronics Designer, <a href="https://www.mistywest.com/posts/5-reasons-to-use-an-iot-framework/" rel="noopener noreferrer" target="_blank">for the MistyWest blog</a>.

Considering a quick IoT solution that will get your product deployed faster? Here’s why you should reconsider.

5 Reasons To Use An IoT Framework For Your Connected Devices

Via in pad is the design practice of placing a via in the copper landing pad of a component. Compared to standard PCB via routing, via in pad allows a design to use smaller component pitch sizes and further reduce the PCBs overall size. With component manufacturers pushing smaller parts every year and the demand from consumers for smaller devices, the usage of via in pad practices by hardware engineers has become more commonplace. In this article, we will discuss the differences between via in pad and traditional vias, when should you use via in pad, and how to design for it. <h3>Via in Pad? What makes them different from Traditional Vias</h3> <img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNjc3MTY1NDI0NDQxLVZpYSBpbiBwYWQuanBnIiwiZWRpdHMiOnsicmVzaXplIjp7IndpZHRoIjo5NTAsImZpdCI6ImNvdmVyIn19fQ==" style="width: 556px;" class="fr-fic fr-dib"> With traditional vias, the signal is routed away from the pad and then to the via. This allows the application of solder mask to prevent solder paste from wicking into the via during the reflow process. In doing so, this prevents a situation that can cause the pad and component connection to fail due to insufficient solder. With via in pad, the drill hole for the via is inside the pad. This means you can not tent the via with solder mask. Leaving the via open to allow the paste to wick into the barrel will cause reliability problems during manufacturing. <img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNjc3MTY1NDgyODQ5LVZpYSBpbiBwYWQgc29sZGVyIHBhc3RlIHdpY2suanBnIiwiZWRpdHMiOnsicmVzaXplIjp7IndpZHRoIjo5NTAsImZpdCI6ImNvdmVyIn19fQ==" style="width: 540px;" class="fr-fic fr-dib"> To reduce manufacturing defects and increase yield, it is best to implement via in pad by having your PCB manufacturer cap the via. This is accomplished by first filling the via with a conductive epoxy and then plating over with copper. Most contract PCB assembly manufacturers will not allow via in pad without first filling and then plating over the via. <img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNjc3MTY1NTI5NDg3LUNhcHBlZCB2cyBUcmFkaXRpb25hbCBWaWEgLmpwZyIsImVkaXRzIjp7InJlc2l6ZSI6eyJ3aWR0aCI6OTUwLCJmaXQiOiJjb3ZlciJ9fX0=" style="width: 556px;" class="fr-fic fr-dib"> <h3>When should I use Via in Pad?</h3>Trying to route and escape component packages with sub 0.5mm pitch with traditional routing methods will cause Design Rule Check errors due to trace width, annular ring, and drill size limitations. Manufacturing limitations on trace size do not allow for smaller and more compact traces to be made with traditional PCB fabrication methods. For these small pitch components, the only effective way to route them is with capped via in pad as this allows the PCB routing to be as compact as possible. <img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNjc3MTY1NTkwMTE4LVRyYWRpdGlvbmFsIFZpYSBSb3V0aW5nIEZhaWxzIERSQy5qcGciLCJlZGl0cyI6eyJyZXNpemUiOnsid2lkdGgiOjk1MCwiZml0IjoiY292ZXIifX19" style="width: 571px;" class="fr-fic fr-dib"> <img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNjc3MTY1NjQzMTkyLUZhaWxzIERSQy5qcGciLCJlZGl0cyI6eyJyZXNpemUiOnsid2lkdGgiOjk1MCwiZml0IjoiY292ZXIifX19" style="width: 565px;" class="fr-fic fr-dib"> Capped via in pad can simplify routing for complex BGA and LGA packages as well. Instead of the traditional fan out, the signals can go straight into the PCB. Surface routing is minimized which can allow components like bypass capacitors to be placed as close as possible to other components, minimizing parasitic inductance. Also, this enables shorter paths to power and ground planes which will help minimize EMF emissions of high-frequency designs. <img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNjc3MTcyOTUwNTA0LWxhc3QgMy5wbmciLCJlZGl0cyI6eyJyZXNpemUiOnsid2lkdGgiOjk1MCwiZml0IjoiY292ZXIifX19" style="width: 434px;" class="fr-fic fr-dib">Vias in thermal pads can also help with heat management. High-power surface mount parts typically have a thermal pad that mounts to the PCB. To dissipate the heat more efficiently, it is wise to drop vias through the PCB to the other side of the PCB to increase the copper area for heat release.Why not use via in pad for every via then? The advantage gained in reducing component fan out and routing complexity is offset by increased manufacturing complexity and material costs of the PCB fabrication process. If the hardware design can be accomplished with traditional style via routing then it is best to avoid via in pad.<h3 id="isPasted">Designing for Via in Pad</h3>Implementing via in pad is very similar to traditional vias. What differs is how it affects the design rule checks for the PCB and how the manufacturing files are created. You will need to make sure your via in pad meets the manufacturer&rsquo;s minimal annular ring requirement. The pad size of the component&rsquo;s footprint must be equal to or larger than the minimal annular ring size. This is usually not an issue as most pad sizes are larger than vias but as BGA packages get smaller this will become a design problem to overcome. If the landing pad&rsquo;s diameter for the BGA is smaller than the combined via and annular ring diameter, then using Solder Mask Defined pads will be your best bet. Consult the part manufacture for more information. <img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNjc3MTcyODE1NDY5LWxhc3QgMi5wbmciLCJlZGl0cyI6eyJyZXNpemUiOnsid2lkdGgiOjk1MCwiZml0IjoiY292ZXIifX19" style="width: 514px;" class="fr-fic fr-dib"> To properly manufacture PCBs that have via in pads, an additional manufacturing file is necessary. Besides the standard excellon drill file that is required, a drill file that just contains the vias that are in component pads and need to be capped and filled is also needed. Using two separate files reduces confusion on which vias need to be capped and reduces manufacturing costs by making sure traditional vias do not get filled and capped. Consult your EDA tool to see if there is an option to do this. If not, modifying your drill file with a Gerber viewer might be needed to create this extra file.<h3>Exceptions to Always Capping Via in Pads</h3>With most design rules there are exceptions and the &ldquo;Always cap via in pads&rdquo; is no exception to that rule! Center pads on QFN packages and thermal center pads for surface mount power parts generally benefit from having open via in pads. Without vias in the center pad of a QFN you can sometimes get trapped gasses or a lifting motion during reflow. These can cause the component to tilt to one side and lose coplanarity to the PCB. The vias in the center pad allow gasses made from the flux in the solder paste to more easily escape and also allows any excess solder paste that is under the part to be drawn through. With thermal pads this extra solder paste that fills the vias has the benefit of improving the thermal conductivity of the via. <img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNjc3MTcyNzAzMzAyLWxhc3QucG5nIiwiZWRpdHMiOnsicmVzaXplIjp7IndpZHRoIjo5NTAsImZpdCI6ImNvdmVyIn19fQ==" style="width: 589px;" class="fr-fic fr-dib"> <h3>Conclusion</h3>With electronic components ever shrinking smaller, hardware engineers will need to utilize and learn new tools and techniques to implement these components in a reliable and scalable way. Via in pad allows the smallest component fan out possible with current PCB construction techniques. When looking at using via in pad techniques, consider the extra manufacturing cost and time that places on your product&rsquo;s bill of materials. Make sure to work closely with your contract PCBA manufacturer as they will be able to give suggestions in regards to how via in pad can change the manufacturing process. Most manufacturers will agree that if your hardware design can be implemented without via in pad, then for cost and reliability reasons the design should avoid via in pad. Ready to get started? <a href="https://factory.macrofab.com/signup" rel="noopener noreferrer" target="_blank">ORDER ONLINE</a>

What makes via in pad different from traditional vias?  Find out in this short blog. 

Via in Pad PCB Design

PCBA designs evolve and become more complex, which is a persistent challenge for engineers and a major risk to the development process. Companies that neglect design complexity can end up slipping behind development schedules, incurring expenses, and missing market deadlines.&nbsp;Additionally, shortened design cycle times reduce available capacity to iterate from concept to first article prototypes, create customer samples, and ultimately build a production release amidst this increase in complexity. Engineers face pressure from both sides, having to do more with less time available.&nbsp;The purpose of this paper is to identify and explore common PCBA complexity factors, impacts, and possible mitigation techniques that can be undertaken before problems arise.<h3>Effects of a Shortened Design Cycle</h3>Many technical and business reasons contribute to the shrinking design cycle. Customer standards push technical boundaries to meet the changing specifications of demanding applications. As a result of persistent integration, design teams now compete to capture a more substantial share of fewer opportunities, accelerating their efforts to reach their goals.&nbsp;This sets up a mindset of doing things right the first time, which is not always possible. Although technical design tools have made the modern design process more comprehensive and efficient than a decade ago, electronic design is an iterative process regardless of how you try to approach it.&nbsp;If technological advances are not examined in depth before full production begins, issues and oversights may arise. Make certain technical manufacturing capabilities get planned, tested, and verified in accordance with a consistent validation process.&nbsp;Engineers validate prototypes during <a href="https://macrofab.com/blog/evt-pcba-product-development/" rel="noopener noreferrer" target="_blank">Engineering Validation Testing (EVT)</a> to ensure the design architecture is functional. Design Validation Testing (DVT) measures performance against specifications and boundary conditions to prove that the design is ready for manufacturing. A <a href="https://macrofab.com/blog/pvt-pcba-product-development/" rel="noopener noreferrer" target="_blank">Production Validation Test (PVT)</a> is the first test to verify that a product can be manufactured in large quantities.&nbsp;With an intentional approach to validation, challenges can be solved earlier in the design flow, rather than becoming an unexpected late issue before the launch of the product. Your CM partner should have a design for manufacturing (DFM) plan template that helps your design team address manufacturing constraints early in the development process. An effective design plan identifies the challenges and how to overcome them.&nbsp;<h3>Bigger Challenges with Smaller Components</h3>SMT (surface mount technology) challenges increase as components get smaller. Component counts have quadrupled in the last few years, while board sizes have remained constant. Designs have become more complex and dense. Several issues are associated with this.&nbsp;Solder bridging shorts are more likely to occur as pin pitches decrease. Components with smaller pin footprints require more attention to the pad design and solder paste application. The pad size needs to be compact enough to allow proper spacing that avoids solder bridging. It should, however, be large enough to accommodate the required solder paste and solder coverage to prevent a cold solder joint.&nbsp;Similarly, handling components becomes more challenging as subtle differences in absolute dimensions are now large relative to each other.&nbsp;<h3>The Most Common Design Issues&nbsp;</h3>Tombstoning&nbsp;Small two-pin passive components such as chip resistors and capacitors should lay horizontally flat on the PCB after assembly. Due to reflow effects on the component, the applied solder paste may not properly keep the device flat. It is possible that the component may raise up and settle vertically without properly completing an electrical path to both sides of the passive. This issue is called &lsquo;Tombstoning&rsquo; since the vertical component visually resembles the look of a tombstone.&nbsp;Component placement depends on solder self-alignment after it is positioned by a pick-and-place machine. However, if the placement is initially skewed during mounting, then the component will not properly align to its pads.&nbsp;Furthermore, the application of solder paste on each pad works best when the solder melts evenly. A component may lift at one end if the whetting between the pads is uneven, causing an &ldquo;open&rdquo;. Preparing the SMT process for proper alignment and whetting will solve this tombstone issue during assembly.&nbsp;Copper Too Close to the PCB Edge&nbsp;When routing a trace, power, or ground plane near the side of a PCB, make sure to meet the design rules for the minimum copper distance to the PCB edge. Minimum spacing is required for a couple of reasons. If the design rules are not followed, the separation of the PCB array could result in metal fragments smearing at the edges. It could lead to unwanted shorts.&nbsp;Furthermore, impedance control can be more challenging near the edges of the PCB since the stack-up of materials can be at the limits of tolerance. Deficiencies in spacing could result in trace impedances outside specifications, leading to an unwanted transmission line effect.&nbsp;Inadequate Annular Ring&nbsp;A trace with a layer termination into a via uses an annular ring layout feature. This layout creates a via in the middle of a well-defined ring of trace signals. For this annular ring to be technically successful, it must allow complete electrical contact from the trace to the via. Several incorrect implementations have the potential to cause failure.&nbsp;Design the annular ring so that it provides an adequate ring area for drilling the via hole. The required dimensions are part of the layout rule for the PCB. Center the drill hole within the ring and don&rsquo;t let it wander outside of a limited area. Otherwise, the via may only have limited partial electrical contact. Additionally, the via-to-via spacing to other nearby rings is critical to prevent shorts from continuous high-current over longer time periods due to conductive anodic filament formation.&nbsp;Acid TrapsWhenever traces are laid out with turns at an acute angle of 90 degrees or less, the acid used in PCB etching may get trapped in a small, confined space and not disperse evenly. To achieve the necessary PCB electrical features, photoresist material must be etched evenly. In the past, legacy etching techniques had this problem. Using outdated equipment or manufacturing without proper mitigation techniques could still pose a potential problem.&nbsp;Slivers&nbsp;There are several tools that can perform PCB array separation, with varying degrees of accuracy and effectiveness. Using a saw tool saves money, but excessive vibrations can cause slivers of PCB material and burs to protrude from the unfinished edges. Separation with a router tool allows more forgiving treatment of PCB edges, but still makes physical contact with them. Laser cutting produces the cleanest approach without any possibility of PCB or copper splinters, but may be prohibitive for lower-cost projects. Your DFM plan can guide the best approach.&nbsp;Via Problems&nbsp;Vias on PCBAs take many forms. Blind vias connect an outer layer with a single inner layer but do not reach the opposite outside layer. Buried vias are connections on the inner PCBA layers that are hidden on the outer layers. Since there is not a single drill hole that aligns a via through the complete board stack-up, alignment between layers needs to be precise. The Via in Pad, however, refers to a via within a solder pad that can be more challenging since the design rules are more complicated.&nbsp;Not all via combinations can be implemented, and advanced vias can increase manufacturing costs. Only use them if you have no alternatives. Via size is also a limiting factor in the selection of PCB technology. Manufacturing technology and complexity will dictate design rules. It is common for limitations to exist, such as:&nbsp;<ul><li>Vias can only travel through an even number of layers&nbsp;</li><li>Vias cannot start or end at the top or bottom of a core&nbsp;</li><li>Vias may have minimum distance criteria from one another</li></ul>In the case when a blind or buried via is required, your CM partner should work with you to provide a digital design tool that outlines the manufacturing rules for these cases. This tool should help with their design, limitation, and cost drivers.&nbsp;EMI Interference&nbsp;It is possible for the spatial routing of signals and the potential for antenna loops to impact the circuit layout. EMI interference within the PCB and externally can have an impact on performance and prevent EMI compliance certification by the FCC. Changing the layout, moving key components, and modifying the enclosure design can have a significant effect on EMI performance. Your CM partner can assist you in the complex design aspects of EMI interference. Additionally, they can assist in getting the final solution certified for EMI emissions by the FCC.&nbsp;Faster design cycles can be a competitive edge for those that have the capacity to execute. But they also involve new challenges to prepare the release of the design for successful manufacturing. Knowing the challenges in advance and preparing for them with your CM manufacturing partner help mitigate issues for a seamless transition from prototypes to large-volume production.&nbsp;By executing the project along the proper validation steps of EVT, DVT, and PVT, hidden challenges can be exposed early and solved during development before they become a problem during manufacturing. Work with an expert CM manufacturing partner to help guide your team through the transition of your project to production.&nbsp;<a href="https://macrofab.com" rel="noopener noreferrer" target="_blank">MacroFab&nbsp;</a>operates the world&rsquo;s first digital electronics manufacturing platform for both low-volume prototype creation and high-scale production. The MacroFab platform enables customers to produce electronics products faster, more cost-effectively, and closer to their end-users via a broad North American factory network, all while leveraging MacroFab&rsquo;s global supply chain and quality control capabilities. The company is headquartered in Houston, TX. Learn about the MacroFab Guarantee and securely upload your design to get a PCB assembly quote in minutes. &nbsp;

PCB designs are becoming more complex every day. 

Engineers face persistent challenges with PCBA designs as they become more complex, posing a risk to the development process as a whole. Those who neglect design complexity may fall behind development schedules, incur expenses, and miss market deadlines.

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<html><head></head><body>Our very first customer at Mergeflow was very good at beating "not invented here" syndrome.He is a very successful innovator with a distinguished career. A physics PhD by training, he started his professional career doing semiconductor research in the R&amp;D department of a large, global technology corporation. He then moved on to running a new business unit (outside the R&amp;D department). After that, he led the spinoff unit of his company. There, he helped commercialize a whole range of technologies into successful spinoff companies.You get the idea. This is a true <a href="https://mergeflow.com/how-to/galilei-style-innovation" rel="noopener" target="_blank">science entrepreneur</a> who is at home in both R&amp;D and business. Also–and this is important–who said that you can’t be an entrepreneur in a large corporation?<h2 id="isPasted">"Not invented here" syndrome happens frequently, and understandably so</h2>At Mergeflow we often hear from innovators how they struggle with "not invented here" (NIH) syndrome in their organization. NIH syndrome refers to the tendency to avoid using products, knowledge, etc. that come from outside one’s own organization (cf. <a href="https://en.wikipedia.org/wiki/Not_invented_here" rel="noopener" target="_blank">this Wikipedia article</a>).<blockquote>Many people view other people’s ideas and solutions as a threat, not as an opportunity.</blockquote>It is understandable that many people show NIH syndrome. When you develop a new technology, product or solution, it’s easy to think that you look less brilliant if you incorporate other people’s ideas. And unfortunately most educational systems enforce this way of thinking, from a very early age onward. As a result, many people view other people’s ideas and solutions as a threat, not as an opportunity.<h2 id="isPasted">So…how did he beat "not invented here" syndrome?</h2>Let’s start by looking at what our customer didn’t do.<h2 id="isPasted">Don’t try to change people’s minds</h2>It’s very tempting to address NIH syndrome heads-on. To somehow try to change people’s minds. Very often, people and organizations try doing this by organizing some kind of event or campaign. For example, this could be an (off-site) event where people talk about culture change and whatnot, and listen to some keynote speaker ("I’ve been to the Valley. And I’ve seen the light…" Narrator’s voice: "He only went there for a week, on an organized tour.").Our customer never did that. No mindset change, culture change, or other <a href="https://mergeflow.com/how-to/5-ways-to-escape-innovation-theater" rel="noopener" target="_blank">innovation theater</a>.Here’s what he did instead when he wanted to bring outside ideas into his organization:<h2 id="isPasted">Find individual people who are open to new ideas</h2>If you want to beat NIH syndrome, it’s good to start with "low-hanging grapes".For example, when our customer wanted to introduce a new idea to a team in his organization, he first approached the most open-minded person from this team. Once he had this person as an "ally", he engaged with the other team members (together with his ally).This didn’t always work. Sometimes he couldn’t find anyone who was open-minded enough. And in situations like that, he wouldn’t try to force anything but moved on instead.<blockquote>Can’t find anyone who is open to new ideas? If this happens, don’t try to force anything. Instead, move on.</blockquote><h2 id="isPasted">Use concrete information, not abstract "trends"</h2>"[TOPIC XYZ] is really trending hot. We need to act now!"You often see this in the context of so-called technology radars, for example. They look like dartboards, where the arrows represent topics (usually described at a very high-level, such as "machine learning" or "blockchain"). And the arrows in the middle of the dartboard represent those topics that need to be acted upon.This can be an interesting exercise, but it is not enough. First, what exactly do you mean by "act"? Who exactly should do what exactly, for how long, etc.? And what exactly do you mean when you say "machine learning" or "blockchain" in the context of your organization?So instead of abstract trends, our customer always used concrete information. Details depend on context, of course. But good examples might be companies with a relevant product or solution; a paper that describes a potentially interesting new technology; or sometimes just a blog post with an interesting idea such as a <a href="https://mergeflow.com/how-to/good-innovation-analyst" rel="noopener" target="_blank">plausible future scenario</a>.But don’t overwhelm people. Nobody has the time to go through a list of 50 companies or 100 papers. Instead, use a handful of findings, or even just a single finding.Note that "single finding" doesn’t necessarily mean "single document". For example, if a finding is a specific company, then this finding might include the founder’s bios, their patents, scientific publications, and news about the company.<h2 id="isPasted">Don’t tell people what to do. Instead, ask them for feedback, or to explain something to you</h2>"Hey, I just found this great paper, and you should really read it."Not a great conversation starter. First, you don’t want to corner people and make them feel like they missed something. Second, you might be wrong. What if your great finding isn’t that great after all? Or what if for some reason the finding is interesting but not relevant, i.e. won’t work in the context of your company?So instead, our customer took his finding and either asked people for feedback, or to explain the finding. He would ask them, "I’m no expert on this, but I saw this…what do you think?". And these feedback conversations were not just high-level generalities, but very specific and detail-oriented. Also, the "recipient" did most of the talking, not our customer.<blockquote id="isPasted">When you share an idea with someone, the other person should do most of the talking, not you. Otherwise you won’t learn anything.</blockquote><h2 id="isPasted">Use information that’s targeted to your audience</h2>It’s no secret that when you share new information with people, you make it easier for them if you reach them where they are.For example, when our customer introduced an idea to a researcher, he would try to find a research paper or other technical contents. This allowed the researcher to evaluate an idea in depth. And this resulted in substantially more valuable feedback or explanations–which led to clearer decisions and faster progress.By contrast, when he talked with someone from finance or marketing, he tried to find information that emphasized the business aspect. For instance, this could be a company’s business model, competitive landscape, a good narrative, or market information.Related readings:<a href="https://mergeflow.com/how-to/how-to-talk-like-a-scientist" rel="noopener" target="_blank"> How to talk like a scientist -&gt;</a><a href="https://mergeflow.com/how-to/talk-like-a-business-person" rel="noopener" target="_blank">How to talk like a business person -&gt;</a></body></html>

Featured image by Huseyin Bostanci from Getty Images.

Our very first customer at Mergeflow was very good at beating "not invented here" syndrome.

He was a very accomplished science entrepreneur. A physics PhD by training, his career spanned semiconductor research, leading a new business unit, and commercializing a whole range of technologies into successful spinoff companies.

In this article I describe the hands-on methods he used to beat "not invented here" syndrome in his organization.

How successful innovators beat "not invented here" syndrome: A real-life example

This article is a part of our <a href="http://www.wevolver.com/student-program" target="_blank">University Technology Exposure Program</a>. The program aims to recognize and reward innovation from engineering students and researchers across the globe.Community voting is now live. Vote for your favorite submission by visiting: <a href="https://www.wevolver.com/utep-community-vote/" rel="noopener noreferrer" target="_blank">University Technology Exposure Program Community Vote</a>.<h2 dir="ltr">Technical description</h2>The robotic device ADIUTOR aims at improving the lives of both post-stroke patient and therapist users, who will be able to treat more patients with significantly lower time and cost than the currently existing solutions. The perfect integration with mobile devices will allow the patient to remain informed about her therapeutic progress, which is essential to keep the patient&#39;s motivation high. Reduced costs and footprints also allow use at the patient&#39;s home where sessions can be carried out at the comfort of their home, after the therapist has set up the training program. Human error will be minimized thanks to the efficiency that the machine offers, which will never be tired or bored, but will carry out therapy with constant results day by day. The physiotherapist will define the patterns that the1 patient will perform during the various sessions and monitor the progress of the results achieved. In the patient&#39;s use scenario, in accordance with the home use (where possible), it will be up to the physiotherapist to take care of all the necessary instructions and warnings to keep the patient in total safety during the conduct of the domestic therapy sessions.ADIUTOR is composed of four main parts: the fixed base, the moving attachment, the moving elements, and the rigid cover. The fixed base can be located on a standard desk at home. A large touch screen is connected to the fixed base for the interactions with the users. The moving attachment (end-effector) of the device hosts the patient&#39;s hand. This part is also equipped with sensors to monitor the patient&#39;s biometric data (Heartbeats, Oxygen saturation, Relative humidity of the contact part). It is useful to understand the patient&#39;s state of effort/stress during the whole therapy. The moving elements are arranged in a robotic (DELTA-like) architecture. They allow three dimensional motions of the moving attachment. The moving elements include specific motors and control hardware. The rigid cover is located above all the moving elements to avoid any risks to the patient.<img alt="ADIUTOR design" src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNjQ4Mjc0MjU1MDcxLWltYWdlNC5wbmciLCJlZGl0cyI6eyJyZXNpemUiOnsid2lkdGgiOjk1MCwiZml0IjoiY292ZXIifX19" class="fr-fic fr-dii">Fig.1 A scheme of ADIUTOR design<iframe width="640" height="360" src="https://www.youtube.com/embed/hU2CVGya29M?&wmode=opaque&rel=0&enablejsapi=1&origin=https://www.wevolver.com" frameborder="0" allowfullscreen="" class="fr-draggable" data-lf-yt-playback-inspected-kn9eq4roawkarlvp="true"></iframe> The Interactive Robotic Device is one of the most valuable innovative elements of this project. This technology is based on IT and the control algorithm is directly linked to the data collected by the Sensitive Haptic Interface. It is essentially a feedback control that can be implemented directly on the central control unit of the robotic device.&nbsp;The interactive tasks aim to involve the patient in the rehabilitation activities; therefore &quot;Serious games&quot; are foreseen. This technique is already known and widely used in rehabilitation activities with robotic machines. The use of Virtual Reality technology would allow the patient to be immersed in the game environment to increase the perception of the three-dimensional movements to be performed. Table 1 reports a summary of ADIUTOR&rsquo;s key features. This includes a touch screen user interface as also shown in Fig.2.Key features of ADIUTOR:<div align="center" dir="ltr"><table><tbody><tr><td>Cost</td><td>Sizes [mm]</td><td>Ranges of motion [mm]</td><td>D.O.F.</td><td>Weight</td><td>Payload</td></tr><tr><td>&lt;25,000 Euros</td><td>500x500x350</td><td>400x400x300</td><td>3&nbsp;</td><td>&lt; 10 Kg</td><td>5 Kg</td></tr></tbody></table></div><img alt="ADIUTOR's UI" src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNjQ4Mjc0Mjc3MjYyLTE2NDgyNzQyNzcyNjIucG5nIiwiZWRpdHMiOnsicmVzaXplIjp7IndpZHRoIjo5NTAsImZpdCI6ImNvdmVyIn19fQ==" id="isPasted" class="fr-fic fr-dii">Fig.2 A scheme of ADIUTOR&rsquo;s user interface.<h2 dir="ltr">Applications of your prototype/product</h2>Thanks to our device, patients could intensify their rehabilitation sessions, practicing several times in the clinic and at home, maintaining a high level of involvement thanks to serious games and artificial intelligence. These factors lead to a huge advantage which is the reduction of rehabilitation times with better results, such as greater coordination.Furthermore, the machine can be used for different scenarios of rehabilitation: Acute rehabilitation: performed in hospitals following the stabilization of the patient after a stroke; Medium-term rehabilitation: performed in public and private rehabilitation clinics on an outpatient basis; Long-term rehabilitation: performed in rehabilitation clinics and in the home setting. Allows for prevention against premature aging; Treating chronic movement problems in the upper limbs; Track progress to keep motivation high. Fig.3 depicts some feasible operation scenarios for ADIUTOR while Figs.4 and 5 show some examples of the operation of a prototype.&nbsp;<img alt="feasible scenarios of ADIUTOR use" src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNjQ4Mjc0NjI4MTk1LWltYWdlNy5qcGciLCJlZGl0cyI6eyJyZXNpemUiOnsid2lkdGgiOjk1MCwiZml0IjoiY292ZXIifX19" class="fr-fic fr-dii" style="width: 758px;">Fig.4. Examples of feasible scenarios with ADIUTOR: a) a scheme with ADIUTOR on a home desk with a screen user interface; b) a scheme with interactive exercising of the upper limb with a patient laying on bed for acute/sub-acute post stroke treatment.<img alt="ADIUTOR on a desk" src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNjQ4Mjc0MDMzMjAzLTE2NDgyNzQwMzMyMDMucG5nIiwiZWRpdHMiOnsicmVzaXplIjp7IndpZHRoIjo5NTAsImZpdCI6ImNvdmVyIn19fQ==" class="fr-fic fr-dii" style="width: 513px;">Fig.4 ADIUTOR version 1 on a conventional home desk.<img alt="ADIUTOR exercise sequence" src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNjQ4Mjc0Njg2OTA1LWltYWdlMi5wbmciLCJlZGl0cyI6eyJyZXNpemUiOnsid2lkdGgiOjk1MCwiZml0IjoiY292ZXIifX19" class="fr-fic fr-dii">Fig.5 A photo sequence of ADIUTOR during a limb exercise.<h2 dir="ltr">About the University Technology Exposure Program 2022</h2>Wevolver, in partnership with <a href="https://mouser.com/" target="_blank">Mouser Electronics</a> and <a href="https://www.ansys.com/" target="_blank">Ansys</a>, is excited to announce the launch of the University Technology Exposure Program 2022. The program aims to recognize and reward innovation from engineering students and researchers across the globe. Learn more about the program <a href="http://www.wevolver.com/student-program" target="_blank">here</a>.<img alt="university-technology-exposure-program-mouser-ansys" src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNjQ4Mjc0MDMxNTc2LTE2NDgyNzQwMzE1NzYucG5nIiwiZWRpdHMiOnsicmVzaXplIjp7IndpZHRoIjo5NTAsImZpdCI6ImNvdmVyIn19fQ==" width="720" height="91" class="fr-fic fr-dii">

ADIUTOR device proposes a novel approach to provide high-intensity, repetitive, task-specific self-treatment at the home of an upper limb and it can help monitor patients' progress as well as personalize their treatment with improved motivation and interaction.

ADIUTOR: A novel Limb Exercising and Monitoring Device

In October 2020, Lancaster University made history when CREATE Education integrated the UK’s first multi-metal LMD-WP additive solution into one of the UK’s leading Universities.Lancaster University aims to accelerate its high-performance manufacturing research capabilities in collaboration with businesses with the installation of the MELTIO M450.Armin Yousefi Kanani is an innovation fellow at Lancaster University. His position involves working with companies to analyse industry problems, find solutions, and develop smart materials that improve an existing product or process performance and/or enable the development of entirely new smart material components that make possible new processes or products. <iframe width="640" height="360" src="https://www.youtube.com/embed/J-7_L2FUkI4?&amp;t=130s&amp;ab_channel=CREATEEducation&amp;wmode=opaque&amp;rel=0" frameborder="0" allowfullscreen="" class="fr-draggable"></iframe><h3>Why the Meltio M450?</h3>“Meltio is an affordable, high-quality metal 3D printer with a great potential to produce low cost, multi-material parts” explains Armin.“A hot research topic in academia is creating multi-material structures in order to produce lightweight structures. The Meltio M450 provides flexibility through its ability to 3D print with both metal powder and wire in the same machine to produce a multi-material structure.”“Meltio allows us to print with either two wires or with wire and powder in the same machine which was not possible in the past. So far this has allowed us to develop new research proposals such as printing fast with wire and using fine powder to create a hard surface finish.”<h3>Experience with the Meltio M450 so far</h3>“Currently we are just printing in the single wire while we await delivery of the laser head. We have printed manufacturers test prints and some simple geometries that will be used as test pieces for our research.”“We have had many discussions with the team at CREATE Education and also the manufacturer’s support teams in the US and Spain to understand the capabilities of the printer as there are lots of academic opportunities so this will assist in putting together proposals for research papers.”“The support I received from the teams at CREATE, in the US and Spain has been great so far,” said Armin.<h3>Research and Applications</h3>The main use of the Meltio M450 will be for research and for use in two funded projects that provide support for businesses in the North West of England to develop products and services.Initial research projects are “The design, manufacture and evaluation of novel, hybrid metallic structures” and “The design of novel alloys and microstructures for additive manufacturing”.<div class="fr-img-space-wrap"><img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNjE3MTA1MDc2MzIzLU1lbHRpb0luc3RhbGwucG5nIiwiZWRpdHMiOnsicmVzaXplIjp7IndpZHRoIjo5NTAsImZpdCI6ImNvdmVyIn19fQ==" style="width: 300px;" class="fr-fic fr-dib">Meltio M450 at Lancaster University&nbsp;</div><h3>About the GISMO Project</h3>GISMO (Greater Innovation for Smarter Materials Optimisation) is a £4.4M project part-funded by the European Regional Development Fund.It supports over 250 innovative SME’s in Cheshire and Warrington by providing cutting-edge ideas and solutions to put their business ahead of the curve in the use, design and manufacture of materials. SME’s can utilise the expertise and technology at Lancaster University to develop their capabilities in additive manufacturing and to:<ul><li>Improve the quality and effectiveness of products and processes.</li><li>Find new materials and formulations for products</li><li>Test and develop materials, ideas and products</li><li>Trial new technologies and processes</li><li>Develop and build prototypes</li><li>Understand developments in materials science</li></ul><h3>Meltio’s Metal 3D Printing Process</h3><table style="width: 100%;"><tbody><tr><td style="width: 33.3333%;"> <div class="fr-img-space-wrap"><img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNjE3MTA0OTAwOTkzLTNkZGVzaWduLmpwZWciLCJlZGl0cyI6eyJyZXNpemUiOnsid2lkdGgiOjk1MCwiZml0IjoiY292ZXIifX19" style="width: 300px;" class="fr-fic fr-dib">3D Design Is the process in which a part is designed and optimised in a 3D model. &nbsp;</div></td><td style="width: 33.3333%;"><div class="fr-img-space-wrap"><img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNjE3MTA0OTA4NDQyLTNkcHJpbnRtZXRhbC5qcGVnIiwiZWRpdHMiOnsicmVzaXplIjp7IndpZHRoIjo5NTAsImZpdCI6ImNvdmVyIn19fQ==" style="width: 300px;" class="fr-fic fr-dib">Printing in Metal The 3D modelled part is printed using laser metal deposition technology. &nbsp;</div></td><td style="width: 33.2487%;"><div class="fr-img-space-wrap"><img src="https://images.wevolver.com/eyJidWNrZXQiOiJ3ZXZvbHZlci1wcm9qZWN0LWltYWdlcyIsImtleSI6ImZyb2FsYS8xNjE3MTA0OTEzOTEyLXBvc3Rwcm9jZXNzaW5nLmpwZWciLCJlZGl0cyI6eyJyZXNpemUiOnsid2lkdGgiOjk1MCwiZml0IjoiY292ZXIifX19" style="width: 300px;" class="fr-fic fr-dib">Post Processing If a highly polished, particular surface finish, or specific feature is required. &nbsp;</div></td></tr></tbody></table>CREATE Education would like to thank Armin Yousefi Kanani for taking the time to talk to us about the use of the Meltio M450 at Lancaster University.To learn more about Meltio metal additive manufacturing solutions visit <a href="//www.createeeducation.com/meltio" rel="noopener noreferrer" target="_blank">www.createeeducation.com/meltio</a> or speak to our specialists at enquries@createeducation.com

Meltio M450 at the Lancaster University Department of Engineering with Armin Yousefi Kanani

Armin Yousefi Kanani, GISMO Innovation Fellow from the Lancaster University Department of Engineering discusses the adoption of the Meltio M450 for research and business engagement.

Metal 3D Printing at Lancaster University

Orthopaedic cast immobilisation is one of the most common ways to treat broken and fractured bones. This process involves the use of materials to encase and restrict the movement of broken bones, allowing them to heal.As technology has become more accessible, 3D Printed casts have grown in popularity. They are much lighter, more comfortable and easier to produce than traditional casts. Despite the evolution in cast production qualities, all casts share a fundamental flaw – they are single-use products.Since the job of a cast is to set body parts in a fixed position, they have to be tailor-made to the unique anatomy of the individual patients.3D printed casts are also complex in their structure, these factors eliminate the possibility of reusing casts, even if hygiene issues were non-existent.&nbsp;CREATE Education Ambassador, <a href="https://www.createeducation.com/community-partner/jack-cockle/" target="_blank">Jack Cockle</a> identified an opportunity to explore alternative strategies to make immobilisation casts more sustainable. With an aim to reduce the inevitable waste generated by their complex and tailored form and maintenance of hygiene standards. <img class="fr-fic fr-dib" src="https://images.wevolver.com/eyJidWNrZXQiOiAid2V2b2x2ZXItcHJvamVjdC1pbWFnZXMiLCAia2V5IjogImZyb2FsYS8xNjA0NDg3NDY4NDE4LUpDUzUuanBnIiwgImVkaXRzIjogeyJyZXNpemUiOiB7IndpZHRoIjogOTUwLCAiZml0IjogImNvdmVyIn19fQ==" style="width: 300px;"><h1 dir="ltr">The Process</h1>As part of one of Jack’s final year projects whilst studying BA (Hons) Sustainable Product Design, he began by making a normal plaster cast, trialling traditional methods of the cast making to justify future design choices.Then making a basic 3D printed cast, by scanning his hand/arm using a 3D scanner and software. Exporting the scan as an STL file into <a href="https://marketplace.createeducation.com/product/fusion-360-software-training/" target="_blank">Autodesk Fusion 360</a>, which was then converted to a b-rep file, allowing Jack to model a form around the hand/arm.Next, 3D printing the cast in <a href="https://marketplace.createeducation.com/?swoof=1&post_type=product&pa_material=petg&paged=1" target="_blank">rPETG</a> on the <a href="https://marketplace.createeducation.com/product/ultimaker-s5-3d-printer/" target="_blank">Ultimaker S5</a>. This was made easier by the scale of the printer, saving time where Jack would have had to split up the model into more pieces, then glueing them together.&nbsp;To explore the scope of making casts more sustainable, Jack evaluated multiple design ideas through an iterative process. The aim was to investigate the possibility of fabricating 3D printed casts that adapt to the form of the user, rather than existing as a rigid form tailored to individual patients, thus making them more suitable for reuse.This idea came to Jack as his colleagues tried on the 3D printed cast, which almost, but didn’t perfectly fit them due to the varied shapes of individuals' limbs.Owing to Auxetic materials and structures exhibiting certain abnormal mechanical responses, thanks to the possession of negative Poisson’s ratio response. Meaning they get thicker when stretched lengthwise and thinner when compressed. Jack began experimenting with auxetic forms in different materials such as <a href="https://marketplace.createeducation.com/product-category/filament/?swoof=1&paged=1&pa_material=tpu&really_curr_tax=812-product_cat" target="_blank">TPU</a> and Flexible Resin.<img class="fr-fic fr-dib" src="https://images.wevolver.com/eyJidWNrZXQiOiAid2V2b2x2ZXItcHJvamVjdC1pbWFnZXMiLCAia2V5IjogImZyb2FsYS8xNjA0NDg4NTU1MjYyLTMwMGRwaUR5bmFtaUNhc3QzLmpwZyIsICJlZGl0cyI6IHsicmVzaXplIjogeyJ3aWR0aCI6IDk1MCwgImZpdCI6ICJjb3ZlciJ9fX0=" style="width: 300px;"> In Rhino3D, Jack generated a series of cylindrical auxetic lattice forms, choosing the ones that required no support material (as this would be difficult to remove from such a complex structure). Jack printed them in both TPU and flexible resin to test how well each structure and material compressed under pressure.The concept was a flexible resin auxetic sleeve that fits over the arm of the patient, which is compressed by the rigid PETg shell, immobilising the limb.In theory, the reusable cast would reduce waste, cut lead times (as a stock of casts could be kept) and the longer-term cost of casts per patient (since the costs of one cast could be distributed across several patients).Jack has been developing the mesh further, to become elastic resin bands that are finer, have more layers, and are preinstalled into the cast shell before being applied to the arm. <img class="fr-fic fr-dib" src="https://images.wevolver.com/eyJidWNrZXQiOiAid2V2b2x2ZXItcHJvamVjdC1pbWFnZXMiLCAia2V5IjogImZyb2FsYS8xNjA0NDg5Mzc1NzUyLTMwMGRwaUR5bmFtaUNhc3QyICgxKS5qcGciLCAiZWRpdHMiOiB7InJlc2l6ZSI6IHsid2lkdGgiOiA5NTAsICJmaXQiOiAiY292ZXIifX19" style="width: 300px;"><hr><h2 dir="ltr">Do you want to CREATE the Future of Education?</h2>Industry is adopting additive manufacturing at an exponential rate, it is critical to be equipped with the skills needed in employment.&nbsp;It is imperative that individuals experience these ground-breaking technologies today, to futureproof UK manufacturing in a globally competitive marketplace and address the many global issues we face.CREATE Education are expert providers across the UK and Ireland, specialising in developing 3D technologies in education, to enable learners and empower educators.&nbsp;Get in touch with our education specialists today on 01257 276 116 or email us at&nbsp;<a href="mailto:enquiries@createeducation.com" target="_blank">enquiries@createeducation.com</a>.

Further harnessing 3D printing technology to promote sustainability within the medical industry

As technology has become more accessible, 3D Printed casts have grown in popularity,  owing to several benefits. However, all casts share a fundamental flaw - they are single-use products

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