Accelerating PCB thermal analysis for rapid drone development
June 25, 2026 at 08:00 PM Central European Summer Time
Join Dr. Azita Soleymani, CTO and Co-Founder of HeatSync, for a webinar exploring practical approaches to thermal management for drone and advanced electronics applications. Learn how engineering teams can address cooling challenges while balancing strict size, weight, power, and cost (SWAP-C) requirements while also designing for demanding operating environments.
Drawing on HeatSync’s practical experience, Dr. Soleymani will demonstrate how CAD-embedded CFD can be integrated into PCB thermal analysis from early concept development through final verification. The session will also cover strategies for improving collaboration and data exchange between electrical and mechanical engineering teams to accelerate development cycles and reduce iteration time. Through a real-world case study, attendees will see how one drone project achieved a 50% reduction in thermal analysis time and a 12% reduction in system weight while meeting performance and reliability goals.
In this webinar, you’ll learn:
Cooling requirements for UAV and drone electronics
How to define thermal management goals early in development
Methods for PCB component placement and cooling evaluation
CAD-embedded CFD workflows using ECAD data
Best practices for cross-functional engineering collaboration
Ways to move from concept to verification more efficiently
